Mushroom-Based Materials
Engineered from agricultural waste and mycelium networks. A fully compostable, high-performance alternative to polystyrene and petroleum plastics.
Grown, Not Manufactured
Our mushroom-based material utilizes mycelium โ the root structure of mushrooms โ to bind agricultural byproducts into a durable, lightweight foam. Grown in custom molds over 5โ7 days, it requires minimal energy and produces zero toxic runoff.
Once end-of-life, it breaks down in home compost within 45 days, returning nutrients to the soil without microplastic contamination.
- โ Fully home & industrial compostable
- โ Carbon-negative production cycle
- โ FDA & EU food-contact compliant
- โ Superior thermal & impact insulation
Why Choose Mycelium Packaging?
Replacing single-use plastics with bio-engineered materials without compromising performance or brand experience.
๐ฑ Zero Landfill Impact
Completely biodegradable in soil. No chemical leaching, no microplastics, and no residual waste after composting.
๐ฆ Custom Molding
Grown to exact dimensions. Reduce material waste by eliminating cutting, trimming, and secondary assembly steps.
๐ก๏ธ Thermal Resilience
Natural insulating properties keep hot items hot and cold items cold longer than standard paper or thin plastics.
๐ Supply Chain Transparency
Traceable agricultural feedstock. Batch-level certifications and full lifecycle documentation provided.
From Farm to Packaging
Our closed-loop production process turns waste into high-performance material.
Feedstock Prep
Agricultural residues (hemp hurds, corn stalks, sawdust) are sterilized and sized for optimal growth.
Mycelium Inoculation
Selected fungal strains are introduced. The mycelium begins colonizing and binding the biomass.
Mold Growth
Material is placed in custom molds. Over 5โ7 days, it grows into the exact desired shape and density.
Heat Treatment
Controlled heat sterilization halts growth, removes moisture, and locks in structural integrity.
Technical Specifications
Lab-tested performance data for standard density mycelium foam (Grade CS-M1).
| Parameter | Value / Range |
|---|---|
| Density | 120โ180 kg/mยณ |
| Compressive Strength | 0.8โ1.2 MPa |
| Thermal Conductivity | 0.038 W/mยทK |
| Water Absorption (24h) | < 8% |
| Compost Degradation | 30โ45 days (home) |
| Fire Rating | Class B1 (treated) / Class C (natural) |
| Certifications | FDA 21 CFR 175.300, EU 10/2011, BPI Certified |
Frequently Asked Questions
Switch to Grown Packaging
Request physical samples, technical datasheets, or schedule a call with our materials engineering team.