Overview
MetalCore Manufacturing specializes in the design and production of critical components for the electronics and semiconductor sectors. From micro-scale precision parts to high-volume thermal interfaces, our facility combines advanced CNC machining, laser processing, and cleanroom assembly to meet the stringent demands of modern electronic systems.
Whether you're developing next-generation power modules, sensor arrays, or high-frequency RF components, our engineering team ensures dimensional accuracy, material integrity, and full traceability across every production run.
Core Capabilities
PCB & Substrate Manufacturing
Multi-layer rigid/flex PCBs, ceramic substrates (AlN, Al₂O₃), and DBC/AMB thermal interface layers.
Thermal Management
CNC machined heat sinks, vapor chambers, cold plates, and micro-fin structures for high-power dissipation.
EMI/RFI Shielding
Precision stamped and formed shields, gaskets, and enclosures meeting military and aerospace standards.
Semiconductor Packaging
Lead frames, TO cans, QFN/DFN substrates, and hermetic sealing components with ±0.005mm tolerances.
Connectors & Interposers
High-density interconnects, PCIe risers, mezzanine connectors, and silicon carbide mountings.
Surface Finishing
ENIG, OSP, Immersion Tin, PTFE coating, anodizing, and chemical conversion for corrosion & conductivity.
Technical Specifications
| Parameter | Specification |
|---|---|
| Dimensional Tolerance | ±0.002mm standard / ±0.0005mm micro-machining |
| Surface Roughness | Ra 0.2 µm to Ra 3.2 µm (custom Ra 0.05 µm available) |
| Materials | Al 6061/7075, Cu, Brass, Stainless 304/316, Invar, Kovar, Ti-6Al-4V, PEEK, PTFE |
| Cleanroom Class | ISO 14644-1 Class 7 (10,000) assembly area |
| Max Panel Size | 600mm × 900mm |
| Min Feature Size | 0.1mm drills / 0.15mm traces |
| Layer Count | Up to 32 layers (rigid), 4-8 layer flex/rigid-flex |
Quality & Compliance
All electronics and semiconductor manufacturing processes at MetalCore are governed by rigorous quality management systems. We maintain full documentation, lot traceability, and statistical process control (SPC) for every batch.
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1
IPC Standards
Compliant with IPC-A-610, IPC-6012, IPC-2221, and J-STD-001 for soldering/assembly.
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2
ESD Protection
Full ESD-controlled environments per ANSI/ESD S20.20 with continuous monitoring.
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3
Material Certification
Mill certs, RoHS/REACH compliance, and incoming inspection for all raw materials.
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4
Advanced Metrology
AOI, X-ray inspection, CMM, profilometry, and thermal cycling validation.
Production Workflow
Our streamlined process ensures rapid turnaround from NRE to high-volume production while maintaining consistent quality metrics.
DFM & Simulation
Thermal, electrical, and mechanical simulation before tooling release.
Rapid Prototyping
Functional prototypes within 5-7 business days for validation testing.
Production Setup
Automated lines, SPC integration, and first-article inspection (FAI).
Delivery & Support
Reel & tube packaging, kitting, and just-in-time logistics with full traceability.
Related Industries
Our electronics manufacturing capabilities also support these adjacent sectors:
Telecommunications Automotive Electronics IoT & Sensors